The LUMION platform is designed to handle different types of laser processes including PERC, LDSE, or LDC and reaches a throughput of up to 7.500 wafers/hour. Special focus was taken on costs versus throughput in order to generate best total cost of ownership for the price driven solar cell manufacturing market.
The LUMION uses a dual line configuration and can used as a fully automated stand-alone system or can be integrated as a PERC system in any printing line or as an LDC configuration in any kind of stringer system at module assembly.
In addition to market introduction of the LUMION, InnoLas Solutions has developed a new laser direct cleaving (LDC) process, using a full cut rather than a scribe and break process, which is working extremely proficient,” says Eckhard Schaefer Vice President Sales Asia at InnoLas Solutions. “We have developed a special, patent pending laser process where we are able to cut it [a full cell into two] with just one pass.”
InnoLas Solutions claims that its new LDC process is advantageous due to the cut cells exciting no shunting or melt along the cut cell edge, and the fact that it is a dustless process – enhancing uptime and doing away with the need for exhaust systems.
Please visit us at the SNEC Shanghai Booth 235 (Hall N3) - Shanghai New Int'l Expo Center, China, 04. – 06. June 2019.