We utilize cutting-edge innovations in laser technology to develop our highly efficient and reliable processing systems for the Electronics industry. Ultrashort pulse laser technology guarantees optimum process results for drilling, scribing, cutting and structuring of PCB materials, ceramic substrates and semiconductor wafers.

Galvanometer scanners or fixed optic process heads are used for positioning the laser beam on the workpiece, depending on the application requirements. Dual process head setups, also in mixed configuration (galvo scanner and fixed optic) are possible. This offers numerous advantages, such as higher productivity and the possibility to run different applications on one machine (e.g. micro-drilling and cutting).

The modular platform concept allows the customization of each laser system for the particular manufacturing task, as stand-alone- or inline-machine.