New separation processes for crystalline silicon solar cells are constantly finding their way into the PV market. One example of this is the innovative cell-cutting technology Laser Direct Cleaving (LDC). InnoLas Solutions’ patented thermal separation process is guided by a laser beam and is a direct separation process.

LDC vs. „Scribe and Break“

While the traditional ‘scribe and break’ process the cell is scribed completely, with LDC the laser only scribes the cell for the process. The scanner-based process involves first inducing a precisely defined microcrack at the cell edge. This crack is then be guided along an almost freely definable line to the opposite edge by the local heat of the laser beam. This means the solar cell is split purely by the tension generated by the laser beam. Not only is this particularly gentle on the material, but it also means that no additional coolants are required.

Your advantages

  • High speed process
  • Particle-free operation
  • No second step required to separate the cells
  • Cost saving
  • Time saving
  • Prevents the risk of microcracks
  • Lower cell breakage rate

A look ahead

The fully automated LDC cell cutting solution combines a laser scribing process with integrated soft break and handling automation. While wafers with sizes starting from 158.75 mm currently present greater challenges for conventional scribing and breaking processes, LDC enables wafers of up to 210 mm in size to be processed.

Recommended machine type: LUMION

The LUMION is a state of  the art laser system for cSi solar cell processing. It achieves a throughput of  up to 7.500 wafers/ hour and is used in 24/ 7 high-volume production. The LUMION is available for various applicatons such as laser direct cleaving- cell cutting (LDC), Passivated Emitter Rear Contact cells (PERC), ... Read more