InnoLas Solutions is a leading supplier of laser systems for Csi solar processing and offers system platforms for various applications:

Backside PERC / Contact Opening

The awarded high speed dash pattern process of InnoLas achieves a similar opening ratio as a dot pattern. The losses in Voc and FF caused by dots, which are not contacted properly, are avoided due to the size of the dashes. An optimized dash pattern can achieve highest cell efficiencies. 

Recommended machine type: LUMION

Laser Diffusion

Laser doped selective emitters (LDSE) reduce the contact resistance through selective overdoping of the contact areas. The InnoLas process solution achieves highest alignment accuracies down to 10 µm, an extremely homogenous energy ditribution through mask imaging with beam sizes from 100 - 300 µm.

Recommended machine type: LUMION

IBC Solar Cell Processing

For laser processing on IBCs a very high alignment accuracy of 10 µm with no deviations of the pattern in the edge area of the wafer is of upmost importance. InnoLas` high accuracy features along with automatic calibration routines are leading in this regard. InnoLas offers dedicated processes for IBCs as e.g. laser contact opening with minimized damage to the surface or local doping.

Recommended machine type: ULTAGO, ULTAGO NX

Cell Cutting

The InnoLas Laser Direct Cleaving (LDC) process is the most advanced approach for cell cutting in the industry. It is available as fully automatic stand alone solution or integrated into a module or printing line.

Recommended machine type: LUMION

LFC (Laser Fired Contacts): FolMet

For laser  fired contacts (LFC) an Aluminum foil is laid down on the rear side of the solar cell and fired by the laser into the Si to form a SiAl alloy. Afterwards the foil is cut around the wafer edges by the laser. The FolMet technology is cheaper than a standard PERC setup through saving the cost of Al paste and the Al printing step.

Recommended machine type: ULTAGO