LED / Semiconductor
Wafer Dicing
Laser dicing of sapphire wafers to separate out (singulate) the individual LEDs for packaging. One step dicing process (metal/DBR, sapphire, active layers) with adjustable cutting depth, clean edges and minimum surface roughness. No chemical etching required after dicing.
Selective DBR / Metal Removal
Selective laser removal of DBR and metal layers on LED chips.