LED / Semiconductor

Wafer Dicing

Laser dicing of sapphire wafers to separate out (singulate) the individual LEDs for packaging. One step dicing process (metal/DBR, sapphire, active layers) with adjustable cutting depth, clean edges and minimum surface roughness. No chemical etching required after dicing.

Selective DBR / Metal Removal

Selective laser removal of DBR and metal layers on LED chips.

recommended machine type