ULTAGO

Turntable Machine for various Applications

The ULTAGO is a powerful laser processing workstation designed for high-precision applications in the photovoltaic, precision engineering, and electronic industries. It achieves maximum throughput for solar cells or ceramic substrates and is used in high-volume production environments. Different from linear table machines, in the turntable machine loading, unloading, alignment, as well as laser processing are carried out in parallel in order to reach optimum productivity.

 

Features

  • Single or dual scanner setup
  • Automatic camera calibration
  • Automated routines for reference runs
  • Automated process control
  • 3-, 5- or even 8-Point alignment methods available (wafer edges or fiducials)
  • Stand alone and production line integrated systems

Download Technical Data

Technical Data
Accuracy< +/- 35 µm (1 sigma)
< +/- 10 µm optionally
< +/- 2 µm repeatability

Substrate
  Dimensions
  Thickness
  Material


up to 161 x 161 mm
> 100 µm
mono or poly crystalline silicon square/
pseudo square, ceramic, PCB

Available laser
sources		Wave length: 1064, 1030, 532, 515, 355 nm
Pulse: µs, ns, ps, fs
Laser spot size10 - 300 µm
Dimensions
  with Automation		2400 x 1600 x 2300 mm
3600 x 3500 x 2300 mm
Weight3500 - 4200 kg
Power supply260 - 480 V
Compressed dry air6-7 bar
Cooling water5 - 20 l/min
Options
  • CAD file import
  • SQL data base for process and event tracking
  • MES interface (SECS GEM PV2)
  • Integrated process metrology
  • Semi-automatic handling (R&D)
  • Fully-automatic handling (production)
Applications

Photovoltaic

  • Backside PERC / Contact Opening
  • IBC Solar Cell Processing
  • Cell Cutting
  • Frontside SiN Ablation
  • Laser Diffusion
  • LFC (Laser Fired Contacts): FolMet
  • Laser Edge Isolation
  • MWT / EWT (Via-Drilling)

Electronic

  • Via Drilling
  • Ceramic Scribing
  • Ceramic Cutting
  • Ceramic Drilling
  • Micromachining
  • Wafer Dicing