LINEXO

LINEAR TABLE MACHINE FOR VARIOUS APPLICATIONS

The LINEXO is a versatile laser processing workstation designed for high-precision applications in the electronic, precision engineering, and photovoltaic industries. It is often used in R&D environments, as well as production of smaller substrates as e.g. ceramic PCBs.

Features

  • Fixed optic or scanner setup
  • Single or dual process heads
  • Process gas (N2,O2,Ar,...)
  • Processing one or more substrates in parallel
  • Automatic camera calibration
  • Automated routines for reference runs
  • Automated process control
  • Automated vision system for precision alignment and scaling, offset, trapezoidal and rotation compensation.
  • Stand alone and production line integrated systems

Download Technical Data

Technical Data
Accuracy< +/- 10 µm abs.
< +/- 2 µm repeatability
Substrate
  Dimensions
  Thickness
  Material
up to 610 x 410 mm
> 50 µm
PCB, Ceramic, Silicon, Steel
Available laser
sources		Wave length: 9.4, 10.6 µm (CO2)
1064, 1030, 532, 515, 355 nm
Pulse: µs, ns, ps, fs
Laser spot size10 - 300 µm
Dimensions1900 x 2800 x 1900 mm
Weight3500 - 4200 kg
Power supply200 - 480 V
Compressed dry air6 - 7 bar
Cooling water5 - 20 l/min
Options
  • CAD file import (Excellon 2, Sieb & Meyer, Gerber)
  • SQL data base for process and event tracking
  • MES interface (SECS GEM PV2)
  • Integrated process metrology
  • Semi-automatic handling (R&D)
  • Fully-automatic handling (production)



Applications

Electronic

  • Via Drilling
  • PCB Cutting
  • PCB Structuring
  • Cavity Formation
  • Ceramic Scribing
  • Ceramic Cutting
  • Ceramic Drilling
  • Cavity Formation
  • Micromachining
  • Wafer Dicing
  • Selective DBR / Metal Removal
  • Micro structuring of printing plates

Photovoltaic

  • for R&D