DIVIDOS

laser depaneling solution

The DIVIDOS with superior ablating technology, set’s the new standard for depaneling of printed circuit board systems.

InnoLas, has now once again demonstrated that the DIVIDOS, developed with the latest technology for market flexibility, will meet all the requirements now and moving forward in laser depaneling of rigid, ridge-flex and flexible printed circuit boards. Separation of materials with unmatched throughput, in a material stress-free environment, without the typical concerns for residue as found in other processes. In a FULL CUT mode the system can produce up to 30% efficiency gains on printed circuit board separation, when compared to other depaneling systems. The laser which operates without physical contact and is subject to almost no wear, resulting in extremely low operating costs. Optionally, using a second galvanometer can up to double the throughput capability of the DIVIDOS. Another advantage is the possibility to process substrates with a size of 18" x 18" (457x457mm).

InnoLas’s new DIVIDOS system meets the requirements of the electronic and automotive industry in particular, and can be automated with many of the leading automation manufacturers using our system standard SMEMA enclosure. The DIVIDOS is available as standalone or inline solutions. All InnoLas Solutions systems are Industry 4.0 capable and can be operated with all common data interfaces.

InnoLas Solutions is a proven leader in the field of laser micro-machining and has now developed the next generation of laser depaneling systems for the printed circuit board industry. InnoLas Solutions well known throughout the industry for their Ultra High-end laser systems, including the functional separation of ceramic circuit boards.

With greater than 20 years of experience with lasers and printed circuit boards ties has provided us a unique insight into the requirements within the printed circuit board Industry.

BENEFITS

  • No tooling costs and better TCO
  • Full cut with 30 % more panels on board
  • High edge quality and less residuals on board
  • No carbonization and very residuals on board
  • Cutting of any shape compared to mechanical cut
  • Cost effective design
  • Simple and easy to maintain
  • Dedicated solution for PCB depaneling
  • Industry 4.0 ready

Options

  • 2nd process head (galvo scanner)
  • Postprocessor for CAD file transfer
  • Exhaust system
  • MES Interface
  • Different carrier options

    Technology

    • High speed Galvo Scanner
    • Automatic calibration routines
    • InnoLas μVision
    • Windows 10 IoT
    • Touch display

    Technical Data

    • Panel Size: 18" x 18"
    • System Accuracy: 50 μm
    • System Repeatability: 20 μm
    • Optical Registration Tool: InnoLas μVision
    • Operating System: Windows 10 IoT

    Automation

    • Fully automated system
    • Stand alone system
    • SMEMA complaint



     

    APPLICATION: Laser Depaneling/ Laser Routing

     

    Download Technical Data