ILS-XT

SPLIT AXIS MACHINE

The ILS-XT is a laser processing workstation designed for high-precision applications in the electronic, precision engineering, and photovoltaic industries. It is mainly used for microvia drilling, cutting (routing), structuring and cavity formation in PCBs with typical dimensions as 610 x 460 mm and 635 x 540 mm.

Features

  • Fixed optic or scanner setup
  • Single or dual process heads
  • Process gas (N2, O2, Ar, ...)
  • Processing one or more substrates in parallel
  • Automatic camera calibration
  • Automated routines for reference runs
  • Automated process control
  • Automated vision system for precision alignment and scaling, offset, trapezoidal and rotation compensation.
  • Stand alone and production line integrated systems

Download Technical Data

Technical Data
Accuracy< +/- 10 µm abs.
< +/- 2 µm repeatability
Substrate
  Dimensions
  Thickness
  Material

up to 900 x 700 mm
> 50 µm
PCB, Ceramic, Silicon, Steel
Available laser
sources
Wave length: 9.4, 10.6 µm (CO2)
1064, 1030, 532, 515, 355 nm
Pulse: µs, ns, ps, fs
Laser spot size10 - 300 µm
Dimensions2900 x 2800 x 2700 mm
Weight5000 - 5500 kg
Power supply200 - 480 V
Compressed dry air6 - 7 bar
Cooling water5 - 20 l/min
Options
  • Import of CAD files (e.g. DXF, DWG) and Excellon 2, Sieb & Meyer and Gerber file formats.
  • SQL data base for process and event tracking
  • MES interface (SECS GEM PV2)
  • Integrated process metrology
  • Semi-automatic handling (R&D)
  • Fully-automatic handling (production)
Applications

Electronic

  • Via Drilling
  • PCB Cutting
  • PCB Structuring
  • Cavity Formation
  • Ceramic Scribing
  • Ceramic Cutting
  • Ceramic Drilling
  • Cavity Formation
  • Micromachining
  • Wafer Dicing
  • Selective DBR / Metal Removal
  • Micro structuring of printing plates