PCB

Via Drilling

Laser drilling of blind vias and through holes in rigid and flex PCBs. Microvias with high aspect ratios and diameters < 50 µm. Trepanning or percussion drilling with ideal hole geometries in various PCB materials, such as RCC, FR4, FR5, polyimide and others.

PCB Cutting

Laser cutting of countours (routing) in rigid / flex PCBs and coverlayers. Clean and highly precise cuts with minimum cut width in various PCB materials, such as RCC, FR4, FR5, PTFE, CEM, polyimide and others.

DEPANELING

Laser cutting of assembled and unassembled PCBs for depaneling. Clean and highly precise cuts with minimum cut width in various PCB materials, such as FR4, FR5, polyimide and others.

PCB Structuring

Laser structuring of the PCB's top copper layer with minimized damage to underlying materials (dielectric). Extremely fine structures < 100 µm with high precision and process repeatability.

Cavity Formation

Laser micromachining of cavities through copper and dielectric layers for microchip inserts. Precise control of ablation depth and geometry of the cavity, in combination with minimized thermal effects and high surface quality.   

recommended machine type

ILS-LT | ILS-XT