Ceramic

Ceramic Scribing

Laser scribing of ceramic substrates to generate a defined break line (perforation or groove) for singulation of the substrates. Fixed optic or galvo scanner based process, depending on laser source, application and material (AlOx, AlNi, DCB substrates, compound materials, etc.). Ultrashort pulse lasers generate burr-free scribe lines and reduce thermally induced tensions in the substrate through cold material ablation.

Ceramic Cutting

Laser cutting of ceramic substrates to form any desired shape (cut-outs, outlines). Fixed optic or galvo scanner based processing, depending on laser source, application and material (AlOx, AlNi, LTCC, HTCC, DCB substrates, compound materials, etc.). Ultrashort pulse lasers generate burr-free cuts and reduce thermally induced tensions in the substrate through cold material ablation.

Ceramic Drilling

Laser drilling of smallest hole diameters in trepanning or percussion mode. Microvias with diameters down to < 40 ┬Ám. Material range: AlOx, AlNi, LTCC, HTCC, DCB substrates, compound materials, etc. Ultrashort pulse lasers generate burr-free holes and reduce thermally induced tensions in the substrate through cold material ablation.

Cavity Formation

Laser micromachining of cavities in ceramic substrates for microchip inserts, etc. Nano- and picosecond laser technology allows precise geometry control of the cavity and ensures minimum thermal effects and high surface quality. Material range: AlOx, AlNi, LTCC, HTCC, DCB substrates, compound materials, etc.

recommended machine type

ILS-LT | ILS-TT